Invention Grant
- Patent Title: Electronic component arrangement structure and electronic device including same
-
Application No.: US16793664Application Date: 2020-02-18
-
Publication No.: US11246229B2Publication Date: 2022-02-08
- Inventor: Sunghyup Lee , Sangmin Kim , Daeyoung Noh , Jungsik Park , Minchang Shim , Seunghoon Lee , Heeseok Jung , Seungki Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: The Farrell Law Firm, P.C.
- Priority: KR10-2019-0019475 20190219
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H04B1/3827 ; H04B1/40 ; H05K5/02

Abstract:
An electronic device is provided. The electronic device includes a housing including a front plate, a rear plate facing in a direction opposite the front plate, and a side member including a support member surrounding a space between the front plate and the rear plate and at least partially extending to the space; a printed circuit board disposed between the rear plate and the support member; an electrical structure disposed around the printed circuit board and includes at least one extension portion at least partially overlapping the printed circuit board when the front plate is viewed from above; and at least one fastening member configured to simultaneously pass through the at least one extension portion and the printed circuit board and fasten to the support member.
Public/Granted literature
- US20200267847A1 ELECTRONIC COMPONENT ARRANGEMENT STRUCTURE AND ELECTRONIC DEVICE INCLUDING SAME Public/Granted day:2020-08-20
Information query