Invention Grant
- Patent Title: Model for predicting distress on a component
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Application No.: US16232700Application Date: 2018-12-26
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Publication No.: US11256245B2Publication Date: 2022-02-22
- Inventor: Srikanth Akkaram , Karan Oberoi , Vasanth Muralidharan , Michael Howard Fisher
- Applicant: GENERAL ELECTRIC COMPANY
- Applicant Address: US NY Schenectady
- Assignee: GENERAL ELECTRIC COMPANY
- Current Assignee: GENERAL ELECTRIC COMPANY
- Current Assignee Address: US NY Schenectady
- Agency: Wood IP LLC
- Main IPC: G05B23/02
- IPC: G05B23/02 ; B64F5/60 ; B64F5/40

Abstract:
An apparatus and method for predicting distress on a physical component. The method can include obtaining distress data. The distress data can be used to determine a distress rank. The distress rank can be compared to a distress output provided by a kernel that use parameters related to the physical component. The comparison can result in a prediction model for the physical component.
Public/Granted literature
- US20200209843A1 MODEL FOR PREDICTING DISTRESS ON A COMPONENT Public/Granted day:2020-07-02
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