• Patent Title: Method for molding a body in a mold
  • Application No.: US15578137
    Application Date: 2016-07-14
  • Publication No.: US11261349B2
    Publication Date: 2022-03-01
  • Inventor: Stephan BerntPatrick Kerep
  • Applicant: TESA SE
  • Applicant Address: DE Norderstedt
  • Assignee: TESA SE
  • Current Assignee: TESA SE
  • Current Assignee Address: DE Norderstedt
  • Agency: Norris McLaughlin PA
  • Priority: DE102015213507.1 20150717
  • International Application: PCT/EP2016/066703 WO 20160714
  • International Announcement: WO2017/012962 WO 20170126
  • Main IPC: C09J7/29
  • IPC: C09J7/29 B29C70/54 B29C33/60
Method for molding a body in a mold
Abstract:
Adhesive tape having a carrier material comprising the following layers: a textile composed of fibers having a softening point greater than or equal to 200° C., and coated with fluoropolymers or silicone polymers, to the top side of which textile a first film composed of fluoropolymers is applied over the whole surface and to the bottom side of which textile a second film is applied over the whole surface, wherein a self-adhesive mass is applied to one side of the carrier material.
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