Invention Grant
- Patent Title: Semiconductor package structure
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Application No.: US16702104Application Date: 2019-12-03
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Publication No.: US11264337B2Publication Date: 2022-03-01
- Inventor: Chia-Cheng Chang , Tzu-Hung Lin , I-Hsuan Peng , Yi-Jou Lin
- Applicant: MEDIATEK INC.
- Applicant Address: TW Hsinchu
- Assignee: MEDIATEK INC.
- Current Assignee: MEDIATEK INC.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/053 ; H01L23/367 ; H01L23/31 ; H01L25/16 ; H01L23/498
Abstract:
A semiconductor package structure is provided. The semiconductor package structure includes a substrate, a semiconductor die and a frame. The semiconductor die is disposed over the substrate. The frame is disposed over the substrate, wherein the frame is adjacent to the semiconductor die, and the upper surface of the frame is lower than the upper surface of the semiconductor die.
Information query
IPC分类:
