Invention Grant
- Patent Title: Encapsulation structure and encapsulation method of electroluminescent device, display panel
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Application No.: US16475714Application Date: 2019-01-10
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Publication No.: US11264592B2Publication Date: 2022-03-01
- Inventor: Dan Wang , Rui Hong , Lei Chen
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Collard & Roe, P.C.
- Priority: CN201810529950.1 20180529
- International Application: PCT/CN2019/071189 WO 20190110
- International Announcement: WO2019/227941 WO 20191205
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L51/56

Abstract:
An encapsulation structure of an organic electroluminescent device includes a substrate, a first inorganic sealing layer and an organic sealing layer. The first inorganic sealing layer is stacked on the substrate, and the organic sealing layer is stacked on a side of the first inorganic sealing layer that is away from the substrate. The organic sealing layer includes a UV light absorbing material and/or a UV resistant polymer material. An encapsulation method of the encapsulation structure of an organic electroluminescent device and a display panel including the encapsulation structure are further provided.
Information query
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