Invention Grant
- Patent Title: Interposer and substrate incorporating same
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Application No.: US16624067Application Date: 2018-05-23
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Publication No.: US11264688B2Publication Date: 2022-03-01
- Inventor: Philippe Coquet , Beng Kang Tay , Mathieu Cometto , Dominique Baillargeat , Stéphane Bila , Kamel Frigui , Philippe Ferrari , Emmanuel Pistono , Florence Podevin
- Applicant: THALES SOLUTIONS ASIA PTE LTD , CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE , UNIVERSITE GRENOBLES ALPES , L'INSTITUT POLYTECHNIQUE DE GRENOBLE , UNIVERSITÉ DE LILLE , UNIVERSITÉ DE LIMOGES , NANYANG TECHNOLOGICAL UNIVERSITY
- Applicant Address: SG Singapore; FR Paris; FR Saint Martin d'Hères; FR Grenoble; FR Lille; FR Limoges; SG Singapore
- Assignee: THALES SOLUTIONS ASIA PTE LTD,CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE,UNIVERSITE GRENOBLES ALPES,L'INSTITUT POLYTECHNIQUE DE GRENOBLE,UNIVERSITÉ DE LILLE,UNIVERSITÉ DE LIMOGES,NANYANG TECHNOLOGICAL UNIVERSITY
- Current Assignee: THALES SOLUTIONS ASIA PTE LTD,CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE,UNIVERSITE GRENOBLES ALPES,L'INSTITUT POLYTECHNIQUE DE GRENOBLE,UNIVERSITÉ DE LILLE,UNIVERSITÉ DE LIMOGES,NANYANG TECHNOLOGICAL UNIVERSITY
- Current Assignee Address: SG Singapore; FR Paris; FR Saint Martin d'Hères; FR Grenoble; FR Lille; FR Limoges; SG Singapore
- Agency: Dinsmore & Shohl, LLP
- Priority: SG10201705250Q 20170623
- International Application: PCT/SG2018/050251 WO 20180523
- International Announcement: WO2018/236286 WO 20181227
- Main IPC: H01P11/00
- IPC: H01P11/00 ; H01P3/12
Abstract:
An interposer (16) and a substrate (10) incorporating the interposer (16) are provided. The interposer (16) includes one or more layers (18) and a cavity (20) defined in the one or more layers (18), the cavity (20) being configured as a waveguide for propagation of electromagnetic waves.
Public/Granted literature
- US20200153074A1 INTERPOSER AND SUBSTRATE INCORPORATING SAME Public/Granted day:2020-05-14
Information query
