Invention Grant
- Patent Title: Support structure for object to be heated
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Application No.: US16145403Application Date: 2018-09-28
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Publication No.: US11265972B2Publication Date: 2022-03-01
- Inventor: Hyunwook Moon , Eui Sung Kim , Byungkyu Park , Jae-Woo Lee
- Applicant: LG Electronics Inc.
- Applicant Address: KR Seoul
- Assignee: LG Electronics Inc.
- Current Assignee: LG Electronics Inc.
- Current Assignee Address: KR Seoul
- Agency: Fish & Richardson P.C.
- Priority: KR10-2017-0128282 20170929
- Main IPC: H05B6/06
- IPC: H05B6/06 ; H02J50/10 ; H05B6/36 ; H05B6/12

Abstract:
Disclosed is a support structure for an induction heating device that includes a working coil configured to heat an object. The support structure includes: a housing including an upper surface that is recessed do inward and that is configured to seat the object; a repeating coil that is located inside of the housing, that is configured to generate magnetic induction or magnetic resonance with the working coil, and that is configured to heat the object on the upper surface of the housing based on magnetic induction or magnetic resonance with the working coil; and a compensation capacitor located inside of the housing and connected to the repeating coil, where the compensation capacitor is configured to control output of the repeating coil.
Public/Granted literature
- US20190104570A1 SUPPORT STRUCTURE FOR OBJECT TO BE HEATED Public/Granted day:2019-04-04
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