Invention Grant
- Patent Title: Laminated glass structures for electronic devices and electronic device covers
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Application No.: US17041876Application Date: 2019-03-27
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Publication No.: US11267221B2Publication Date: 2022-03-08
- Inventor: Jin Su Kim , Dean Michael Thelen
- Applicant: CORNING INCORPORATED
- Applicant Address: US NY Corning
- Assignee: CORNING INCORPORATED
- Current Assignee: CORNING INCORPORATED
- Current Assignee Address: US NY Corning
- International Application: PCT/US2019/024384 WO 20190327
- International Announcement: WO2019/191300 WO 20191003
- Main IPC: B32B7/027
- IPC: B32B7/027 ; B32B17/06

Abstract:
A laminated glass structure is provided that includes: a core glass layer having a first coefficient of thermal expansion (CTE); and a plurality of clad glass layers, each having a CTE that is lower than or equal to the first CTE of the core glass layer. A first of the clad layers is laminated to a first surface of the core glass layer and a second of the clad layers is laminated to a second surface of the core glass layer. Further, the total thickness of the core glass layer and the clad glass layers ranges from about 0.1 mm to about 3 mm. In addition, the laminated glass structure is characterized by a transmission power of at least 75% and at least 55% for signals at 28 GHz and 60 GHz, respectively, as calculated in a Three-Layer Model.
Public/Granted literature
- US20210008832A1 LAMINATED GLASS STRUCTURES FOR ELECTRONIC DEVICES AND ELECTRONIC DEVICE COVERS Public/Granted day:2021-01-14
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