An optoelectronic module includes a housing and a printed circuit board (“PCB”) positioned within the housing. A positioning member is coupled to the PCB and includes one or more receptacles each configured to receive and secure positioning of an optical component relative to the PCB. The positioning member may include a plurality of receptacles positioned relative to one another in an arrangement defining a vertical array of receptacles, a lateral array of receptacles, or both. In one form, an optical component, when positioned in a receptacle of the positioning member, is spaced from the PCB. The positioning member may be formed of a thermally insulative or thermally conductive material, and a number of optical fibers may be routed between the positioning member and the housing.