Invention Grant
- Patent Title: Thin-film capacitor and method for manufacturing thin-film capacitor
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Application No.: US16617106Application Date: 2018-05-16
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Publication No.: US11276531B2Publication Date: 2022-03-15
- Inventor: Koichi Tsunoda , Kazuhiro Yoshikawa , Mitsuhiro Tomikawa , Kenichi Yoshida
- Applicant: TDK Corporation
- Applicant Address: JP Tokyo
- Assignee: TDK Corporation
- Current Assignee: TDK Corporation
- Current Assignee Address: JP Tokyo
- Agency: Faegre Drinker Biddle & Reath LLP
- Priority: JPJP2017-107849 20170531,JPJP2017-108223 20170531,JPJP2017-108226 20170531
- International Application: PCT/JP2018/018974 WO 20180516
- International Announcement: WO2018/221228 WO 20181206
- Main IPC: H01G4/33
- IPC: H01G4/33 ; H01G4/01 ; H01G4/232

Abstract:
A thin-film capacitor includes an insulating base member, and a capacitance portion that is laminated on the insulating base member has a plurality of internal electrode layers which are laminated on the insulating base member and are provided in a lamination direction and dielectric layers which are sandwiched between the internal electrode layers. A relative dielectric constant of the dielectric layers is 100 or higher.
Public/Granted literature
- US20200258690A1 THIN-FILM CAPACITOR AND METHOD FOR MANUFACTURING THIN-FILM CAPACITOR Public/Granted day:2020-08-13
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