Invention Grant
- Patent Title: Fluidic dies with conductive members
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Application No.: US16958578Application Date: 2019-04-29
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Publication No.: US11279130B2Publication Date: 2022-03-22
- Inventor: Michael W Cumbie , David J Benson , Randy Hoffman , Amy Gault
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US CO Fort Collins
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US CO Fort Collins
- Agent Austin Rapp
- International Application: PCT/US2019/029714 WO 20190429
- International Announcement: WO2020/222766 WO 20201105
- Main IPC: B41J2/14
- IPC: B41J2/14 ; B41J2/16

Abstract:
Examples include a fluidic device comprising a fluidic die, a support element, and a conductive member. The support element is coupled to the fluidic die, and the support element has a fluid channel formed therein. The fluid channel exposes at least a portion of a back surface of the fluidic die. The support element further includes a member opening passing therethrough. The conductive member is connected to the fluidic die, and the conductive member is a least partially disposed in the member opening such that a portion of the conductive member is exposed to the fluid channel of the support element.
Public/Granted literature
- US20210229440A1 FLUIDIC DIES WITH CONDUCTIVE MEMBERS Public/Granted day:2021-07-29
Information query
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