Invention Grant
- Patent Title: Cooling module and circuit board
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Application No.: US16852594Application Date: 2020-04-20
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Publication No.: US11284533B2Publication Date: 2022-03-22
- Inventor: Shuichi Kawata , Takafumi Moriasa , Masatoshi Kakue , Masahiko Shigaki , Yuichi Kusano , Norihiro Kawahara
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Keating & Bennett, LLP
- Priority: JPJP2019-089867 20190510
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/18 ; H05K1/11 ; H05K1/02 ; H01L23/473

Abstract:
A cooling module includes an electroosmotic pump. The electroosmotic pump includes a first electrode which is permeable to a cooling fluid, a second electrode which is located with an interval from the first electrode and is permeable to the fluid, and a dielectric layer which is located between the first electrode and the second electrode and includes a microchannel which is permeable to the fluid. The first electrode and the second electrode have different polarities.
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