Invention Grant
- Patent Title: Semiconductor package structure
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Application No.: US16725307Application Date: 2019-12-23
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Publication No.: US11289394B2Publication Date: 2022-03-29
- Inventor: Sheng-Yu Chen , Chang-Lin Yeh , Ming-Hung Chen
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/00 ; H01L23/29 ; H01L23/538 ; H01L25/065 ; H01L21/56
Abstract:
A semiconductor package includes a substrate having a first side and a second side opposite to the first side, a first type semiconductor die disposed on the first side of the substrate, a first compound attached to the first side and encapsulating the first type semiconductor die, and a second compound attached to the second side, causing a stress with respect to the first type semiconductor die in the first compound. A method for manufacturing the semiconductor package described herein is also disclosed.
Public/Granted literature
- US20210193545A1 SEMICONDUCTOR PACKAGE STRUCTURE Public/Granted day:2021-06-24
Information query
IPC分类:
