A technique for interconnecting PV cells using partial overlapping method is disclosed with at least one part of the PV cell is applied with a non-conductive bonding material. Another PV cell is then placed above this PV cell in a partial overlapping manner and depending on the type of bonding material used, the necessary curing step is performed. The disclosed method can be used to interconnect 1) PV cells; 2) shingled PV strings; 3) PV cell and other components to external circuitry, within a shingled PV module. The interconnecting method also improves the aestheticism, reliability, and manufacturability of shingled PV modules that are constructed with shingled PV cells.