- 专利标题: Shield connector having improved bonding strength to a substrate
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申请号: US17004542申请日: 2020-08-27
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公开(公告)号: US11289855B2公开(公告)日: 2022-03-29
- 发明人: Yoshimi Wada , Takayuki Kobayashi , Isao Kameyama
- 申请人: Yazaki Corporation
- 申请人地址: JP Tokyo
- 专利权人: Yazaki Corporation
- 当前专利权人: Yazaki Corporation
- 当前专利权人地址: JP Tokyo
- 代理机构: Sughrue Mion, PLLC
- 优先权: JPJP2019-156445 20190829
- 主分类号: H01R13/6586
- IPC分类号: H01R13/6586 ; H01R13/6597 ; H01R13/6587 ; H01R12/70 ; H01R12/72
摘要:
A shield connector includes a shield member for covering an outer periphery of a terminal, and a substrate mounting surface provided on the shield member and fixed to a surface of a substrate via solder, wherein the substrate mounting surface has a reference surface and a stepped surface having a different height with respect to the reference surface. For example, the stepped surface is formed by at least one of a convex portion protruding from the reference surface of the substrate mounting surface and a concave portion recessed from the reference surface of the substrate mounting surface.
公开/授权文献
- US20210066863A1 SHIELD CONNECTOR 公开/授权日:2021-03-04
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