Invention Grant
- Patent Title: Donor substrate for depositing deposition material on acceptor substrate, method of depositing deposition material, and method of fabricating donor substrate
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Application No.: US16302799Application Date: 2017-12-14
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Publication No.: US11294272B2Publication Date: 2022-04-05
- Inventor: Lujiang Huangfu
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE Technology Group Co., Ltd.
- Current Assignee: BOE Technology Group Co., Ltd.
- Current Assignee Address: CN Beijing
- Agency: Intellectual Valley Law, P.C.
- International Application: PCT/CN2017/116190 WO 20171214
- International Announcement: WO2019/113891 WO 20190620
- Main IPC: G03F1/38
- IPC: G03F1/38 ; C23C14/24 ; H01L51/00
Abstract:
The present application discloses a donor substrate for depositing a deposition material on an acceptor substrate. The donor substrate includes a base substrate; a patterned thermal barrier layer on the base substrate; and a plurality of openings each of which extending through the patterned thermal barrier layer.
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