Invention Grant
- Patent Title: Coil component
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Application No.: US16533058Application Date: 2019-08-06
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Publication No.: US11295890B2Publication Date: 2022-04-05
- Inventor: Dong Jin Lee , Dong Hwan Lee , Young Ghyu Ahn , Chan Yoon , Won Chul Sim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2019-0025970 20190306
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F27/32

Abstract:
A coil component includes a body; a first substrate disposed inside of the body, and a second substrate, disposed below the first substrate; a first coil layer disposed on an upper surface of the first substrate; a second coil layer disposed between the first substrate and the second substrate; a third coil layer disposed on a lower surface of the second substrate; a conductive via passing through the first substrate and connecting the first coil layer and the second coil layer to each other; a connection electrode disposed outside of the body and connecting the second coil layer and the third coil layer to each other; a first external electrode disposed outside of the body and connected to the first coil layer; and a second external electrode disposed outside of the body and connected to the third coil layer.
Public/Granted literature
- US20200286677A1 COIL COMPONENT Public/Granted day:2020-09-10
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