Invention Grant
- Patent Title: Multilayer capacitor and manufacturing method for the same
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Application No.: US16536621Application Date: 2019-08-09
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Publication No.: US11295897B2Publication Date: 2022-04-05
- Inventor: Yong Il Kwon , Jung Tae Park , Jin Kyung Joo , Ha Jung Song
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2019-0019696 20190220,KR10-2019-0047167 20190423
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/12 ; H01G4/248 ; H01G4/012

Abstract:
A multilayer capacitor includes: a capacitor body formed by placing two or more stacked units in a row in a stacking direction of dielectric layers, each stacked unit including a plurality of dielectric layers, and a plurality of first and second internal electrodes alternately disposed with the dielectric layers interposed therebetween; and first and second external electrodes disposed on the capacitor body to be electrically connected to the first and second internal electrodes, respectively, and, in the capacitor body, adjacent stacked units are disposed to allow surfaces with similar density to be adjacent to each other.
Public/Granted literature
- US20200265998A1 MULTILAYER CAPACITOR AND MANUFACTURING METHOD FOR THE SAME Public/Granted day:2020-08-20
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