- Patent Title: Layout structure between substrate, micro-LED array and micro-vacuum module for micro-LED array transfer using micro-vacuum module, and method for manufacturing micro-LED display using the same
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Application No.: US16727248Application Date: 2019-12-26
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Publication No.: US11295972B2Publication Date: 2022-04-05
- Inventor: Keon Jae Lee , Han Eol Lee , Tae Jin Kim , Jung Ho Shin , Sang Hyun Park
- Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Applicant Address: KR Daejeon
- Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Current Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
- Current Assignee Address: KR Daejeon
- Agency: NSIP Law
- Priority: KR10-2018-0067701 20180612,KR10-2018-0076935 20180703
- Main IPC: H01L21/683
- IPC: H01L21/683 ; H01L21/677 ; B65G47/91 ; H01L33/62
Abstract:
The present disclosure provides a method for transfer and assembly of RGB micro-light-emitting diodes using vacuum suction force whereby the vacuum state of micrometer-sized adsorption holes to which micro-light-emitting diodes formed on a mother substrate or a temporary substrate are bonded is controlled selectively, so that only the micro-light-emitting diode devices desired to be detached from the mother substrate or the temporary substrate are detached from the mother substrate or the temporary substrate using vacuum suction force and then transferred to a target substrate.
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