- Patent Title: Array substrate, method for fabricating the same and display panel
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Application No.: US16641372Application Date: 2019-05-23
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Publication No.: US11296122B2Publication Date: 2022-04-05
- Inventor: Hongwei Tian , Yanan Niu , Meng Zhao , Lei Wang , Zheng Liu
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Myers Bigel, P.A.
- Priority: CN201810508747.6 20180524
- International Application: PCT/CN2019/088100 WO 20190523
- International Announcement: WO2019/223755 WO 20191128
- Main IPC: H01L27/12
- IPC: H01L27/12

Abstract:
Embodiments of the present disclosure provide an array substrate including a base substrate, an active layer on the base substrate, a first gate insulating layer on the active layer, a first gate on the first gate insulating layer, and a second gate insulating layer on the first gate. The second gate insulating layer includes a first sub-insulating layer and a second sub-insulating layer disposed in a direction away from the active layer, and a hydrogen content of the first sub-insulating layer is larger than a hydrogen content of the second sub-insulating layer. A method for fabricating the array substrate and a display panel including the array substrate are also provided.
Public/Granted literature
- US20210375952A1 ARRAY SUBSTRATE, METHOD FOR FABRICATING THE SAME AND DISPLAY PANEL Public/Granted day:2021-12-02
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