- Patent Title: Imaging apparatus and manufacturing method for imaging apparatus
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Application No.: US16640957Application Date: 2018-07-06
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Publication No.: US11296136B2Publication Date: 2022-04-05
- Inventor: Nobuyuki Nagai , Shusaku Yanagawa
- Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Applicant Address: JP Kanagawa
- Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- Current Assignee Address: JP Kanagawa
- Agency: Sheridan Ross P.C.
- Priority: JPJP2017-164240 20170829
- International Application: PCT/JP2018/025629 WO 20180706
- International Announcement: WO2019/044172 WO 20190307
- Main IPC: H01L27/146
- IPC: H01L27/146
Abstract:
In an imaging apparatus provided with a substrate having transparency, warping of the substrate is prevented while stray light is shielded. The imaging apparatus includes a sensor chip, a transparent substrate, a light shielding wall, and an optical filter. In this imaging apparatus, a solid-state imaging element is provided in a light receiving region of the sensor chip. Furthermore, in the imaging apparatus, the transparent substrate is equipped on an outer edge portion of the sensor chip. In addition, in the imaging apparatus, the light shielding wall shields light that passes through the transparent substrate and enters the front light receiving region. The light shielding wall is formed on the optical filter.
Public/Granted literature
- US20200212096A1 IMAGING APPARATUS AND MANUFACTURING METHOD FOR IMAGING APPARATUS Public/Granted day:2020-07-02
Information query
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