Invention Grant
- Patent Title: Flexible strip assembly system
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Application No.: US16872796Application Date: 2020-05-12
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Publication No.: US11296474B2Publication Date: 2022-04-05
- Inventor: Yingcong Deng , Dandan Zhang , Zhonghua Xu , Zongjie Tao , Roberto Francisco-Yi Lu
- Applicant: Tyco Electronics (Shanghai) Co. Ltd. , TE Connectivity Corporation
- Applicant Address: CN Shanghai; US PA Berwyn
- Assignee: Tyco Electronics (Shanghai) Co. Ltd.,TE Connectivity Corporation
- Current Assignee: Tyco Electronics (Shanghai) Co. Ltd.,TE Connectivity Corporation
- Current Assignee Address: CN Shanghai; US PA Berwyn
- Agency: Barley Snyder
- Priority: CN201920705642.X 20190516
- Main IPC: H01R43/16
- IPC: H01R43/16

Abstract:
A flexible strip assembly system includes a first conveyor conveying a first layer of material, a pick-up device picking up a conductor and placing the conductor at a predefined position on an upper surface of the first layer of material, a second conveyor conveying a second layer of material, and a first pair of guiding rollers. The conductor is conveyed under driving of the first layer of material. The first pair of guiding rollers press and stick the second layer of material to the first layer of material and the conductor on the upper surface of the first layer of material to form a flexible strip with the conductor clamped between the first layer of material and the second layer of material. At least one of the upper surface of the first layer of material and a lower surface of the second layer of material has an adhesive layer.
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