Invention Grant
- Patent Title: Optical device package
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Application No.: US16664652Application Date: 2019-10-25
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Publication No.: US11302682B2Publication Date: 2022-04-12
- Inventor: Tsung-Yueh Tsai , Meng-Jen Wang , Yu-Fang Tsai , Meng-Jung Chuang
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01L23/31 ; H01L21/52 ; H01L23/538 ; H01L21/48
Abstract:
An optical device package comprises a carrier having a first surface and a second surface recessed with respect to the first surface and a lid disposed on the second surface of the carrier.
Public/Granted literature
- US20210125974A1 OPTICAL DEVICE PACKAGE Public/Granted day:2021-04-29
Information query
IPC分类:
