Invention Grant
- Patent Title: Nitride semiconductor device
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Application No.: US16879053Application Date: 2020-05-20
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Publication No.: US11302690B2Publication Date: 2022-04-12
- Inventor: Hirotaka Otake
- Applicant: ROHM Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: ROHM Co., Ltd.
- Current Assignee: ROHM Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann, Mueller & Larson, P.C.
- Priority: JPJP2019-101659 20190530
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L27/085 ; H01L29/06 ; H01L29/20 ; H01L21/8252 ; H01L29/66 ; H01L21/76 ; H01L29/205

Abstract:
The present invention provides a nitride semiconductor device capable of forming a half-bridge circuit and suppressing changes in current collapse characteristics.
A first transistor of the present invention includes a first nitride semiconductor layer, and a first gate electrode, a first source electrode and a first drain electrode formed thereon. The second transistor includes a second nitride semiconductor layer, and a second gate electrode, a second source electrode and a second drain electrode formed thereon. The source electrode is electrically connected to a lower region of a first region on the substrate, the second source electrode is electrically connected to a lower region of a second region on the substrate, and a first insulating region is disposed between a portion corresponding to the first region on the substrate and a portion corresponding to the second region on the substrate.
A first transistor of the present invention includes a first nitride semiconductor layer, and a first gate electrode, a first source electrode and a first drain electrode formed thereon. The second transistor includes a second nitride semiconductor layer, and a second gate electrode, a second source electrode and a second drain electrode formed thereon. The source electrode is electrically connected to a lower region of a first region on the substrate, the second source electrode is electrically connected to a lower region of a second region on the substrate, and a first insulating region is disposed between a portion corresponding to the first region on the substrate and a portion corresponding to the second region on the substrate.
Public/Granted literature
- US20200381422A1 NITRIDE SEMICONDUCTOR DEVICE Public/Granted day:2020-12-03
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