Invention Grant
- Patent Title: Fabrication of gate all around device
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Application No.: US17006802Application Date: 2020-08-29
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Publication No.: US11302792B2Publication Date: 2022-04-12
- Inventor: Yung-Chih Wang , Yu-Chieh Liao , Tai-I Yang , Hsin-Ping Chen
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Maschoff Brennan
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/66 ; H01L29/78 ; H01L29/06 ; H01L29/786

Abstract:
A device includes a nanowire, a gate dielectric layer, a gate electrode, a gate pickup metal layer, and a gate contact. The nanowire extends in a direction perpendicular to a top surface of a substrate. The gate dielectric layer laterally surrounds the nanowire. The gate electrode laterally surrounds the gate dielectric layer. The gate pickup metal layer is in contact with a bottom surface of the gate electrode and extends laterally past opposite sidewalls of the gate electrode. The gate contact is in contact with the gate pickup metal layer.
Information query
IPC分类: