Invention Grant
- Patent Title: De-contented fluid ejection
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Application No.: US16332200Application Date: 2016-10-12
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Publication No.: US11305557B2Publication Date: 2022-04-19
- Inventor: Yubai Bi , Guillermo Martinez Ariza
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Tong Rea Bentley & Kim LLC
- International Application: PCT/US2016/056633 WO 20161012
- International Announcement: WO2018/071016 WO 20180419
- Main IPC: B41J2/01
- IPC: B41J2/01 ; B41M7/00 ; B41J11/00 ; B41M5/00 ; C09D11/30 ; B41J2/155 ; B41J2/21

Abstract:
In example implementations, a system is provided. The system includes at least one fluid ejection apparatus, a heater and an energy source. The at least one fluid ejection apparatus dispenses a de-contented fluid onto a substrate during conveyance of the substrate. The heater is arranged after the at least one fluid ejection apparatus along a substrate conveying path. The heater removes a liquid from the de-contented fluid on the substrate such that the particles of the de-contented fluid remain on the substrate. The energy source is arranged after the heater along the substrate conveying path. The energy source applies energy to the substrate during the conveyance of the substrate to heat the substrate to a temperature that is approximately a melting temperature of the substrate to fuse the particles on the substrate to the substrate.
Public/Granted literature
- US20190270302A1 DE-CONTENTED FLUID EJECTION Public/Granted day:2019-09-05
Information query
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