Invention Grant
- Patent Title: HPC case clearance control thermal control ring spoke system
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Application No.: US16848475Application Date: 2020-04-14
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Publication No.: US11306604B2Publication Date: 2022-04-19
- Inventor: Enzo DiBenedetto , Paul E. Coderre
- Applicant: Raytheon Technologies Corporation
- Applicant Address: US CT Farmington
- Assignee: Raytheon Technologies Corporation
- Current Assignee: Raytheon Technologies Corporation
- Current Assignee Address: US CT Farmington
- Agency: Bachman & LaPointe, P.C.
- Main IPC: F01D11/18
- IPC: F01D11/18 ; F01D25/12

Abstract:
A case clearance control system comprising a blade outer air seal support structure having a plurality of protrusions extending radially from the blade outer air seal support structure opposite a blade outer air seal proximate the blade outer air seal support structure; a thermal control ring coupled to the blade outer air seal support structure, the thermal control ring including a plurality of receivers configured to couple with the plurality of protrusions; a thermal break formed between the plurality of protrusions and the plurality of receivers, the thermal break configured to control heat transfer between the blade outer air seal support structure and the thermal control ring; and a plurality of flow passages formed between the blade outer air seal support structure, the thermal control ring and the plurality of protrusions, the plurality of flow passages configured to allow cooling air flow to condition the thermal control ring and maintain thermal control ring dimensions.
Public/Granted literature
- US20210317749A1 HPC CASE CLEARANCE CONTROL THERMAL CONTROL RING SPOKE SYSTEM Public/Granted day:2021-10-14
Information query
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