发明授权
- 专利标题: Multilayer substrate, actuator, and method of manufacturing multilayer substrate
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申请号: US16511012申请日: 2019-07-15
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公开(公告)号: US11309113B2公开(公告)日: 2022-04-19
- 发明人: Shingo Ito
- 申请人: Murata Manufacturing Co., Ltd.
- 申请人地址: JP Nagaokakyo
- 专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人: Murata Manufacturing Co., Ltd.
- 当前专利权人地址: JP Nagaokakyo
- 代理机构: Keating & Bennett, LLP
- 优先权: JPJP2017-059289 20170324
- 主分类号: H01F7/08
- IPC分类号: H01F7/08 ; H01F7/126 ; H01F27/28 ; H01F7/16
摘要:
A multilayer substrate includes a stacked body including a principal surface and insulating base material layers made of a thermoplastic resin that are stacked, and a coil including coil conductors. The coil includes a winding axis in a stacking direction. The coil conductors includes a first coil conductor closest to the principal surface, and a second coil conductor adjacent to or in a vicinity of the first coil conductor. The second coil conductor includes a wide portion of which a line width is larger than a line width of the first coil conductor. The wide portion includes an overlapping portion that overlaps with the first coil conductor, and a non-overlapping portion that does not overlap with the first coil conductor, when viewed from the stacking direction. The non-overlapping portion is curved to be closer to the principal surface than to the overlapping portion.
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