- 专利标题: DC high voltage relay and contact material for DC high-voltage relay
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申请号: US16980047申请日: 2019-03-12
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公开(公告)号: US11309141B2公开(公告)日: 2022-04-19
- 发明人: Sachihiro Nishide , Tetsuya Nakamura , Hiroyuki Itakura , Nobuhito Yanagihara
- 申请人: TANAKA KIKINZOKU KOGYO K.K.
- 申请人地址: JP Tokyo
- 专利权人: TANAKA KIKINZOKU KOGYO K.K.
- 当前专利权人: TANAKA KIKINZOKU KOGYO K.K.
- 当前专利权人地址: JP Tokyo
- 代理机构: Foley & Lardner LLP
- 优先权: JPJP2018-050054 20180316
- 国际申请: PCT/JP2019/009841 WO 20190312
- 国际公布: WO2019/176891 WO 20190919
- 主分类号: H01H1/0237
- IPC分类号: H01H1/0237 ; H01H50/58
摘要:
A DC high-voltage relay including at least one contact pair including a movable contact and a fixed contact, having a contact force and/or opening force of 100 gf or more, the DC high-voltage relay of 48 V or more. The movable contact and/or the fixed contact includes Ag oxide-based contact material. Metal components in the contact material includes at least one metal M essentially containing Sn, and a balance including Ag and inevitable impurity metals. The content of the metal M is 0.2% by mass or more and 8% by mass or less based on the total mass of all metal components in the contact material. The contact material has a material structure in which one or more oxides of the metal M are dispersed in a matrix including Ag or a Ag alloy. As metal M, In, Bi, Ni and Te can be added.
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