Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16827187Application Date: 2020-03-23
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Publication No.: US11309310B2Publication Date: 2022-04-19
- Inventor: Kohei Shinsho
- Applicant: ROHM CO., LTD.
- Applicant Address: JP Kyoto
- Assignee: ROHM CO., LTD.
- Current Assignee: ROHM CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Hamre, Schumann. Mueller & Larson, P.C.
- Priority: JPJP2017-012264 20170126
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L29/06 ; H01L29/861 ; H01L29/40 ; H01L29/739 ; H01L27/07 ; H01L29/08 ; H01L29/10

Abstract:
A semiconductor device includes a semiconductor layer of a first conductivity type having a first principal surface on one side and a second principal surface on the other side, the semiconductor layer in which a device formation region and an outer region outside the device formation region are set, a channel region of a second conductivity type formed in a surface layer portion of the first principal surface of the semiconductor layer in the device formation region, an emitter region of a first conductivity type formed in a surface layer portion of the channel region, a gate electrode formed at the first principal surface of the semiconductor layer in the device formation region, the gate electrode facing the channel region across a gate insulating film, a collector region of a second conductivity type formed in a surface layer portion of the second principal surface of the semiconductor layer in the device formation region, an inner cathode region of a first conductivity type formed in the surface layer portion of the second principal surface of the semiconductor layer in the device formation region, and an outer cathode region of a first conductivity type formed in the surface layer portion of the second principal surface of the semiconductor layer in the outer region.
Public/Granted literature
- US20200227405A1 SEMICONDUCTOR DEVICE Public/Granted day:2020-07-16
Information query
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