Invention Grant
- Patent Title: Resin composition, copper foil with resin, dielectric layer, copper clad laminate sheet, capacitor element and printed wiring board with built-in capacitor
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Application No.: US16493531Application Date: 2018-03-09
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Publication No.: US11310910B2Publication Date: 2022-04-19
- Inventor: Yoshihiro Yoneda , Toshifumi Matsushima , Toshihiro Hosoi , Kenshiro Fukuda
- Applicant: MITSUI MINING & SMELTING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUI MINING & SMELTING CO., LTD.
- Current Assignee: MITSUI MINING & SMELTING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: WOPCT/JP2017/010221 20170314
- International Application: PCT/JP2018/009327 WO 20180309
- International Announcement: WO2018/168718 WO 20180920
- Main IPC: H05K1/03
- IPC: H05K1/03 ; B32B15/04 ; B32B15/20 ; C08L63/04 ; C08L77/00 ; H01G4/12 ; H01G4/14 ; H05K1/09 ; H05K1/16
Abstract:
A resin composition for use in a dielectric layer of a capacitor device or a capacitor-embedded printed circuit board is provided in which the resin composition can improve stability in capacitance and insulation properties of the capacitor device under high temperature and high humidity and ensures high adhesion of the dielectric layer to the device. The resin composition comprises a resin component and a dielectric filler. The resin component comprises an epoxy resin, an active ester resin, and an aromatic polyamide resin.
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