Invention Grant
- Patent Title: Device for analyzing impact and puncture resistance
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Application No.: US16630715Application Date: 2018-04-30
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Publication No.: US11313879B2Publication Date: 2022-04-26
- Inventor: Donald L. McCarty, II , Erick Sutanto , Larry Dotson , Brayden E. Glad , Hitendra Singh , John Lund
- Applicant: Dow Global Technologies LLC , Rohm and Haas Company
- Applicant Address: US MI Midland; US PA Collegeville
- Assignee: Dow Global Technologies LLC,Rohm and Haas Company
- Current Assignee: Dow Global Technologies LLC,Rohm and Haas Company
- Current Assignee Address: US MI Midland; US PA Collegeville
- Agency: Dinsmore & Shohl LLP
- International Application: PCT/US2018/030277 WO 20180430
- International Announcement: WO2019/027521 WO 20190207
- Main IPC: G01Q60/38
- IPC: G01Q60/38 ; G01N3/42

Abstract:
A device for analyzing a physical characteristic of a film sample is described herein. The device includes a clamping system configured to hold the film sample. The device further includes a dart probe system configured to test a physical characteristic of the film sample. The dart probe system has a dart probe, a propulsion system configured to move the dart probe relative to the clamping system, and a force sensor configured to measure a force that the dart probe is subjected to during a movement of the dart probe. The force sensor is configured to measure a force imparted to the film sample when the dart probe comes in contact with the film sample.
Public/Granted literature
- US20210088551A1 DEVICE FOR ANALYZING IMPACT AND PUNCTURE RESISTANCE Public/Granted day:2021-03-25
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