Invention Grant
- Patent Title: Loading apparatus and physical vapor deposition apparatus
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Application No.: US16626863Application Date: 2018-06-15
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Publication No.: US11315768B2Publication Date: 2022-04-26
- Inventor: Xuewei Wu , Tong Wang , Boyu Dong , Jun Zhang , Bingliang Guo , Jun Wang , Henan Zhang , Baogang Xu , Huaichao Ma , Shaohui Liu , Kangning Zhao , Yujie Geng , Qingxuan Wang , Yaxin Cui
- Applicant: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Current Assignee: BEIJING NAURA MICROELECTRONICS EQUIPMENT CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Anova Law Group, PLLC
- Priority: CN201710554503.7 20170630
- International Application: PCT/CN2018/091643 WO 20180615
- International Announcement: WO2019/001298 WO 20190103
- Main IPC: H01J37/32
- IPC: H01J37/32 ; C23C14/35 ; C23C14/50 ; H01J37/34

Abstract:
The present disclosure provides a loading apparatus and a physical vapor deposition (PVD) apparatus. The loading apparatus includes a pedestal configured to support a workpiece; and a first support member placed on the pedestal and configured to push up a cover ring when the pedestal is at an operation position to prevent an overlapping portion of a cover ring and the workpiece from contacting each other. In the loading apparatus and the PVD apparatus, the first support member supports the cover ring, such that the cover ring does not contact the workpiece, thereby reducing stress forces on the workpiece by external components.
Information query