Invention Grant
- Patent Title: Wafer singulation process control
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Application No.: US16067748Application Date: 2016-12-23
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Publication No.: US11315832B2Publication Date: 2022-04-26
- Inventor: Wayne Fitzgerald
- Applicant: Rudolph Technologies, Inc.
- Applicant Address: US MA Wilmington
- Assignee: Rudolph Technologies, Inc.
- Current Assignee: Rudolph Technologies, Inc.
- Current Assignee Address: US MA Wilmington
- Agency: Dicke, Billig & Czaja, PLLC
- International Application: PCT/US2016/068519 WO 20161223
- International Announcement: WO2017/117051 WO 20170706
- Main IPC: H01L21/78
- IPC: H01L21/78 ; H01L21/66 ; G06T7/13 ; G06T7/00 ; G06T7/55 ; G06T7/73 ; G06T7/33
Abstract:
A method for monitoring and controlling a substrate singulation process is described. Device edges are imaged and identified for analysis. Discrepancies in device edges are noted and used to modify a singulation process and to monitor the operation of singulation processes for anomalous behavior.
Public/Granted literature
- US20190019728A1 WAFER SINGULATION PROCESS CONTROL Public/Granted day:2019-01-17
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