Invention Grant
- Patent Title: Light emitting device and method of manufacturing the light emitting device
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Application No.: US16546215Application Date: 2019-08-20
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Publication No.: US11315913B2Publication Date: 2022-04-26
- Inventor: Hiroaki Ukawa , Yusuke Hayashi
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Foley & Lardner LLP
- Priority: JPJP2017-095850 20170512
- Main IPC: H01L25/16
- IPC: H01L25/16 ; H01L29/866 ; H01L33/50 ; H01L33/52 ; H01L33/56 ; H01L33/60 ; H01L25/075 ; H01L33/62 ; H01L23/00 ; H01L33/54

Abstract:
A light emitting device includes: a base comprising a first lead, a second lead, and a supporting member; a light emitting element mounted on the first lead; a protection element mounted on the second lead; a wire including a first end and a second end, wherein the first end is connected to an upper surface of the first lead, and the second end is connected to a first terminal electrode of the protection element; a resin frame located on an upper surface of the base, wherein the resin frame covers at least part of the protection element and surrounds the light emitting element and the first end of the wire; a first resin member surrounded by the resin frame and covering the light emitting element and the first end of the wire; and a second resin member covering the resin frame and the first resin member.
Information query
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