Invention Grant
- Patent Title: Integrated circuit device and method of fabricating the same
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Application No.: US17038217Application Date: 2020-09-30
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Publication No.: US11316010B2Publication Date: 2022-04-26
- Inventor: Hwi-Chan Jun , Heon-jong Shin , In-chan Hwang , Jae-ran Jang
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/78 ; H01L29/417 ; H01L27/088

Abstract:
An integrated circuit device is provided as follows. A fin-type active region extends on a substrate in a first horizontal direction. A gate line extends on the fin-type active region in a second horizontal direction intersecting the first horizontal direction. A source/drain region is disposed in the fin-type active region at one side of the gale line. An insulating cover extends parallel to the substrate, with the gate line and the source/drain region arranged between the insulating cover and the substrate. A source/drain contact that vertically extends through the insulating cover has a first sidewall covered with the insulating cover and an end connected to the source/drain region. A fin isolation insulating unit vertically extends through the insulating cover into the fin-type active region. The source/drain region is arranged between the fin isolation insulating unit and the gate line.
Public/Granted literature
- US20220102491A1 INTEGRATED CIRCUIT DEVICE AND METHOD OF FABRICATING THE SAME Public/Granted day:2022-03-31
Information query
IPC分类: