Invention Grant
- Patent Title: Semiconductor device including metal holder and method of manufacturing the same
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Application No.: US16860877Application Date: 2020-04-28
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Publication No.: US11322468B2Publication Date: 2022-05-03
- Inventor: You-Lung Yen , Bernd Karl Appelt
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/00
- IPC: H01L23/00
Abstract:
A semiconductor device and a method of manufacturing the same are provided. The semiconductor device includes a substrate and a metal holder. The substrate includes at least one bonding pad disposed adjacent to its surface and the metal holder is disposed adjacent to the bonding pad.
Public/Granted literature
- US20210335742A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-10-28
Information query
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