- Patent Title: Multi-chip photonic node for scalable all-to-all connected fabrics
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Application No.: US17086044Application Date: 2020-10-30
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Publication No.: US11323787B1Publication Date: 2022-05-03
- Inventor: Kevin B. Leigh , Luca Ramini , Mir Ashkan Seyedi , Steven Dean , Marco Fiorentino
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Applicant Address: US TX Houston
- Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Current Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Current Assignee Address: US TX Houston
- Agency: Hewlett Packard Enterprise Patent Department
- Main IPC: H04J14/00
- IPC: H04J14/00 ; H04Q11/00 ; G02B6/43

Abstract:
A photonic node includes a first circuit disposed on a first substrate and a second circuit disposed on a second substrate different from the first substrate. The first circuit is configured to route light signals originated from the photonic node to local nodes of a local group in which the photonic node is a member. The second circuit is configured to route light signals received from a node of an external group in which the photonic node is not a member, to one of the local nodes.
Public/Granted literature
- US20220141557A1 MULTI-CHIP PHOTONIC NODE FOR SCALABLE ALL-TO-ALL CONNECTED FABRICS Public/Granted day:2022-05-05
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