Invention Grant
- Patent Title: Heat sink and communications product
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Application No.: US17079408Application Date: 2020-10-23
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Publication No.: US11330737B2Publication Date: 2022-05-10
- Inventor: Xiaowei Hui , Yuping Hong , Wei Chen
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: CN Guangdong
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Guangdong
- Agent James Anderson Harrison
- Priority: CN201611260377.6 20161230
- Main IPC: H05K7/20
- IPC: H05K7/20

Abstract:
A heat sink includes a base and a plurality of fins. A root of the fin is connected to the base. A heated area, a dropping pipe, and a spacing strip between the heated area and the dropping pipe are formed in the fin. A first passage and a second passage are formed between the heated area and the dropping pipe. A hydraulic diameter of a pipeline in the heated area is less than a critical dimension. A hydraulic diameter of a pipeline of the dropping pipe is greater than or equal to the critical dimension, and a pressure of liquid at an intersection of the second passage and the dropping pipe is greater than a pressure of liquid at an intersection of the second passage and the heated area.
Public/Granted literature
- US20210045263A1 Heat Sink and Communications Product Public/Granted day:2021-02-11
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