Invention Grant
- Patent Title: Electronically-activated, self-molding and re-shapeable load-bearing support structure system and methods for molding thereof
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Application No.: US16579837Application Date: 2019-09-24
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Publication No.: US11331405B2Publication Date: 2022-05-17
- Inventor: Yong Zhu , Cheuk Yin Lee , Chenmin Liu , Shengbo Lu
- Applicant: Nano and Advanced Materials Institute Limited
- Applicant Address: HK Hong Kong
- Assignee: Nano and Advanced Materials Institute Limited
- Current Assignee: Nano and Advanced Materials Institute Limited
- Current Assignee Address: HK Hong Kong
- Agency: Idea Intellectual Limited
- Agent Margaret A. Burke; Sam T. Yip
- Main IPC: A61F5/00
- IPC: A61F5/00 ; A61L15/14 ; A61L15/12 ; A61D9/00

Abstract:
An electronically-activated, self-molding and re-shapeable load-bearing support structure system is provided that includes a first composite structure. The first composite structure includes a first layer of a first thermally-responsive polymer; one or more first heating elements positioned adjacent to the first layer on a first heating element side; a second layer of the first thermally-responsive polymer positioned adjacent to the first heating elements on a second heating element side; a temperature sensor communicating with at least the first layer or the second layer of the first thermally-responsive polymer; one or more electrical connectors electrically communicating with the heating elements; and an electrical controller detachably connectable to at least one of the electrical connectors of the composite for providing an electrical current to the heating elements. A method of molding the load-bearing support structure system is also provided.
Public/Granted literature
- US2155382A Hydraulic release for well bottoms Public/Granted day:1939-04-25
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