Invention Grant
- Patent Title: Die for a printhead
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Application No.: US16956350Application Date: 2019-02-06
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Publication No.: US11331911B2Publication Date: 2022-05-17
- Inventor: James M. Gardner , Scott A. Linn
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- International Application: PCT/US2019/016790 WO 20190206
- International Announcement: WO2020/162914 WO 20200813
- Main IPC: B41J2/045
- IPC: B41J2/045 ; B41J2/14
Abstract:
A die for a printhead is provided in examples. The die includes a memory voltage regulator disposed on the die, and a high-voltage protection switch disposed on the die in a path of a conductive connection between the memory voltage regulator and a sense bus.
Public/Granted literature
- US20210362494A1 DIE FOR A PRINTHEAD Public/Granted day:2021-11-25
Information query
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