发明授权
- 专利标题： Supporting assembly
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申请号： US17019661申请日： 2020-09-14
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公开(公告)号： US11332089B2公开(公告)日： 2022-05-17
- 发明人: Chi-Cheng Hsiao , Ying-Chao Peng , Chun-Ying Yang
- 申请人： Inventec (Pudong) Technology Corporation , INVENTEC CORPORATION
- 申请人地址： CN Shanghai; TW Taipei
- 专利权人： Inventec (Pudong) Technology Corporation,INVENTEC CORPORATION
- 当前专利权人： Inventec (Pudong) Technology Corporation,INVENTEC CORPORATION
- 当前专利权人地址： CN Shanghai; TW Taipei
- 代理机构： Locke Lord LLP
- 代理商 Tim Tingkang Xia, Esq.
- 优先权： CN202010507181.2 20200605
- 主分类号： H05K5/02
- IPC分类号： H05K5/02 ; B60R16/023 ; H05K5/00 ; H05K5/06
摘要：
A supporting assembly configured to fix a casing of an electronic device to a chassis and including a plate body, a cushioning component and a fastener. The plate body includes a mounting hole. The cushioning component is disposed through the mounting hole. The cushioning component includes a through hole. The fastener is disposed through the through hole of the cushioning component. A side of the fastener is configured to be fixed to the chassis, and the cushioning component is compressed by another side of the fastener and the chassis.
公开/授权文献
- US20210380052A1 SUPPORTING ASSEMBLY 公开/授权日：2021-12-09
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