Invention Grant
- Patent Title: Methods of forming microelectronic devices, and related microelectronic devices and electronic systems
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Application No.: US16905763Application Date: 2020-06-18
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Publication No.: US11335602B2Publication Date: 2022-05-17
- Inventor: Kunal R. Parekh
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: TraskBritt
- Main IPC: H01L21/8234
- IPC: H01L21/8234 ; H01L21/768 ; H01L23/528 ; H01L27/11556 ; H01L27/11582
Abstract:
A method of forming a microelectronic device comprises forming a microelectronic device structure comprising a base structure; a doped semiconductive material overlying the base structure; a stack structure overlying the doped semiconductive material; semiconductive structures extending from within the base structure, through the doped semiconductive structure, and into a lower portion of the stack structure; cell pillar structures horizontally aligned with the semiconductive structures and vertically extending through an upper portion of the stack structure; and digit line structures vertically overlying the stack structure. An additional microelectronic device structure comprising control logic devices is formed. The microelectronic device structure is attached to the additional microelectronic device structure to form an assembly. The base structure and portions of the semiconductive structures are removed. The doped semiconductive material is then patterned to form at least one source structure coupled to the cell pillar structures. Devices and systems are also described.
Public/Granted literature
- US20210398859A1 METHODS OF FORMING MICROELECTRONIC DEVICES, AND RELATED MICROELECTRONIC DEVICES AND ELECTRONIC SYSTEMS Public/Granted day:2021-12-23
Information query
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