Invention Grant
- Patent Title: LED module and method for manufacturing LED module
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Application No.: US17001703Application Date: 2020-08-25
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Publication No.: US11335841B2Publication Date: 2022-05-17
- Inventor: Yasuhiro Kanaya , Gen Koide
- Applicant: Japan Display Inc.
- Applicant Address: JP Tokyo
- Assignee: Japan Display Inc.
- Current Assignee: Japan Display Inc.
- Current Assignee Address: JP Tokyo
- Agency: Xsensus LLP
- Priority: JPJP2019-156806 20190829
- Main IPC: H01L33/60
- IPC: H01L33/60 ; H01L33/62 ; H01L27/15 ; G09F9/33
Abstract:
An LED module includes a first metal layer disposed on a base surface and an LED chip disposed on the first metal layer. The first metal layer includes a first end portion forming a contour away from the base surface, and a curved portion between a region overlapping the LED chip and the first end portion.
Public/Granted literature
- US20210066557A1 LED MODULE AND METHOD FOR MANUFACTURING LED MODULE Public/Granted day:2021-03-04
Information query
IPC分类:
