Invention Grant
- Patent Title: Hinge adapters
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Application No.: US17054534Application Date: 2018-09-14
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Publication No.: US11336067B2Publication Date: 2022-05-17
- Inventor: Chyun Nan Liu
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: HP Inc. Patent Department
- International Application: PCT/US2018/051188 WO 20180914
- International Announcement: WO2020/055432 WO 20200319
- Main IPC: G06F1/16
- IPC: G06F1/16 ; H01R31/06 ; H01R35/02 ; H01R13/62
Abstract:
In an example, a hinge adapter may include a first connector portion to removably engage with a first electronic device, and a second connector portion to removably operably engage with a second electronic device. Further, the hinge adapter may include a hinge connecting the first connector portion and the second connector portion. The first connector portion may rotate relative to the second connector portion via the hinge.
Public/Granted literature
- US20210313750A1 HINGE ADAPTERS Public/Granted day:2021-10-07
Information query
