Invention Grant
- Patent Title: Radio frequency module and communication device
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Application No.: US17022117Application Date: 2020-09-16
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Publication No.: US11336312B2Publication Date: 2022-05-17
- Inventor: Morio Takeuchi , Yukiya Yamaguchi , Yoichi Sawada
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Xsensus LLP
- Priority: JPJP2019-171740 20190920
- Main IPC: H04B1/04
- IPC: H04B1/04 ; H04B1/10 ; H04B1/16

Abstract:
A radio frequency module includes: a switch that includes: a common terminal connected to a first common transmission path; a first selection terminal connected to a first transmission path; and a second selection terminal connected to a second transmission path, and switches between connecting the common terminal to the first selection terminal and to the second selection terminal; a transmission power amplifier disposed on the module board and on first common transmission path; and first circuit components disposed on a reception path. The first transmission path is a path through which a transmission signal of a first communication band is transferred, the second transmission path is a path through which a transmission signal of a second communication band is transferred, the switch is disposed on a first principal surface, and at least one of the first circuit components is disposed on a second principal surface.
Public/Granted literature
- US20210091803A1 RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE Public/Granted day:2021-03-25
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