Invention Grant
- Patent Title: Radio-frequency module and communication device
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Application No.: US17022148Application Date: 2020-09-16
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Publication No.: US11336315B2Publication Date: 2022-05-17
- Inventor: Takayuki Shinozaki , Yukiya Yamaguchi , Morio Takeuchi , Yoichi Sawada
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Nagaokakyo
- Agency: Xsensus LLP
- Priority: JPJP2019-171568 20190920,JPJP2020-057932 20200327
- Main IPC: H04B1/04
- IPC: H04B1/04 ; H04B1/16

Abstract:
A radio frequency module includes a module board including a first principal surface and a second principal surface on opposite sides of the module board, a transmission power amplifier connected to a transmission path, a first circuit component connected to a reception path, and a control circuit that controls the transmission power amplifier. The control circuit is disposed on the first principal surface, and the first circuit component is disposed on the second principal surface.
Public/Granted literature
- US20210091807A1 RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE Public/Granted day:2021-03-25
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