Invention Grant
- Patent Title: Packing coil
-
Application No.: US16905457Application Date: 2020-06-18
-
Publication No.: US11337708B2Publication Date: 2022-05-24
- Inventor: Jake Le , Heath Bowman
- Applicant: MicroVention, Inc.
- Applicant Address: US CA Aliso Viejo
- Assignee: MicroVention, Inc.
- Current Assignee: MicroVention, Inc.
- Current Assignee Address: US CA Aliso Viejo
- Agency: Inskeep IP Group, Inc.
- Main IPC: A61B17/12
- IPC: A61B17/12 ; A61B17/00 ; A61B17/42
Abstract:
An occlusion device formed of a microcoil having a three-dimensional relaxed state employing open looped portions interposed between closed loop portions. Planes defined by sequentially formed open looped and closed loop portions are neither coincident nor parallel to one another.
Public/Granted literature
- US20200315630A1 Packing Coil Public/Granted day:2020-10-08
Information query
