- Patent Title: Vapor deposition mask substrate, vapor deposition mask substrate manufacturing method, vapor deposition mask manufacturing method, and display device manufacturing method
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Application No.: US16019277Application Date: 2018-06-26
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Publication No.: US11339465B2Publication Date: 2022-05-24
- Inventor: Mikio Shinno , Reiji Terada , Kiyoaki Nishitsuji
- Applicant: TOPPAN PRINTING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: TOPPAN PRINTING CO., LTD.
- Current Assignee: TOPPAN PRINTING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Squire Patton Boggs (US) LLP
- Priority: JPJP2017-173153 20170908
- Main IPC: C23C14/04
- IPC: C23C14/04 ; C23F1/02 ; H01L51/00 ; H01L51/56

Abstract:
The percentage of a height of each undulation with respect to a length of the undulation is a unit steepness. A steepness is an average value of unit steepnesses of all undulations in a longitudinal direction at each of different positions in a width direction of a metal sheet. The maximum value of steepnesses in a center section in the width direction is less than or equal to 0.3%. The maximum value of steepnesses in a first edge in the width direction and a maximum value of steepnesses in a second edge section in the width direction are less than or equal to 0.6%. The maximum value of steepnesses in at least one of the first edge section and the second edge section in the width direction is less than the maximum value of steepnesses in the center section in the width direction.
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