Invention Grant
- Patent Title: Vacuum processing system with holding arrangement
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Application No.: US15772979Application Date: 2016-01-13
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Publication No.: US11339469B2Publication Date: 2022-05-24
- Inventor: Simon Lau
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- International Application: PCT/EP2016/050525 WO 20160113
- International Announcement: WO2017/121467 WO 20170720
- Main IPC: C23C14/50
- IPC: C23C14/50 ; B65G49/06 ; H01L21/683 ; H01L21/687 ; C23C16/458
Abstract:
The present disclosure provides a holding arrangement. The holding arrangement for holding a substrate includes: a body portion having a first side; a dry adhesive material provided on the first side of the body portion; a seal surrounding the dry adhesive material and configured to provide a vacuum region on the first side, wherein the dry adhesive material is provided in the vacuum region; and a conduit to evacuate the vacuum region.
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